WHY THIS FIELD STAYS SEPARATE
The same terminal-block shape can hide a different assembly route.
Pitch, positions, vertical/right-angle presentation and screw/spring conductor termination help choose a product family. None of them proves how the exact component may be soldered to the PCB.
The current YIHENTRA catalog has 53 model references across 4 families, but no verified model-level solder-process field. That gap is shown openly instead of filled from an external look-alike.
PROCESS TERMINOLOGY
Four labels; four different evidence paths.
Through-hole technology
- Board interface
- Component leads or solder pins pass through PCB holes.
- Joining route
- May use manual soldering, selective soldering or wave soldering when the exact component and process permit it.
- Evidence to request
- Pin geometry, finished holes, board thickness, soldering and cleaning instructions.
THT describes the board interface; it does not by itself name the soldering process.
Wave soldering
- Board interface
- Typically joins through-hole solder contacts from the underside of the PCB.
- Joining route
- The populated board passes over a controlled solder wave according to the assembly process.
- Evidence to request
- Exact mounting approval, material limits, pin length, board layout, process and cleaning notes.
A through-hole shape does not prove that the exact ordered terminal block is qualified for the planned wave process.
Through-hole reflow
- Board interface
- Through-hole pins are placed into paste-filled holes and processed in a reflow line.
- Joining route
- It combines a through-hole interface with a reflow process only for components designed and documented for THR.
- Evidence to request
- Reflow/process specification, component temperature classification, allowed cycles, pin/paste geometry and packaging.
THR is not a generic permission to run any THT terminal block through reflow.
Surface-mount technology
- Board interface
- Component contacts join surface pads without conventional through-hole solder pins.
- Joining route
- The component is placed in solder paste and processed by the qualified reflow method.
- Evidence to request
- Exact SMD variant, land pattern, coplanarity/retention, packaging, placement data and process specification.
A visually similar THT or THR part is not an SMD substitute.
DO NOT COLLAPSE THESE FIELDS
A familiar label can answer one question and leave the process unknown.
Keep the known value, then request the missing model-level evidence.
DESIGN-IN & RFQ CHECKLIST
Ten records to close before the assembly line.
- 01
Exact orderable identity
Full model, suffix, positions, pitch, revision and whether the reference is a plug, header or direct terminal.
- 02
Declared mounting type
Manufacturer field that explicitly states THT/manual, wave, THR or SMD/SMT for the exact variant.
- 03
Process specification
The applicable soldering/processing document rather than a temperature copied from another series.
- 04
Pin and land geometry
Pin size and length, row layout, finished holes or surface pads, paste opening and mechanical retention.
- 05
Thermal and cycle limits
Classification or component limit, number of permitted cycles and time/profile evidence from the exact source.
- 06
Packaging and placement
Bulk, tray or tape-and-reel; pick-and-place suitability, nozzle/centroid data and board support where required.
- 07
PCB and assembly inputs
Board thickness and finish, copper/thermal mass, neighboring components, side of assembly and planned line sequence.
- 08
Cleaning and handling
Flux, cleaning compatibility, moisture sensitivity or storage/handling notes when the product documentation specifies them.
- 09
Inspection and acceptance
Solder-joint criteria, seating/coplanarity, housing damage checks, electrical inspection and traceable first-article evidence.
- 10
Production-intent sample
Run the exact ordered component on the intended board and line before releasing volume production.
CURRENT YIHENTRA CATALOG BOUNDARY
Product pages can start the request; they cannot supply a missing process field.
Use current model pages for family, pitch, positions, mounting label, supplied ratings, images and available drawings. Then request the exact process and packaging evidence before line or board approval.
OFFICIAL TERMINOLOGY SOURCES
Use the source structure; do not transplant its values.
These sources prove that mounting process, component design, packaging, pin geometry and processing notes belong to exact products. They do not establish process suitability for a YIHENTRA reference.
PCB SOLDERING FAQ
Confirm the exact model before using an assembly label.
Is THT the same as wave soldering?
No. THT describes leads or pins passing through PCB holes. Wave soldering is one possible joining process for suitable through-hole components; manual or selective processes may also use a THT interface.
Are THR and SMT the same?
No. Both can be processed in a reflow line, but THR uses through-hole pins and paste-filled holes, while SMT/SMD components use surface contacts and pads. Each requires its own exact component and PCB evidence.
Does vertical or right-angle mounting identify the soldering process?
No. Vertical and right-angle labels describe product presentation relative to the PCB. The soldering/mounting technology must be confirmed separately for the exact orderable variant.
Are current YIHENTRA terminal blocks confirmed for THR or SMT?
The current online catalog does not publish a verified model-level solder-process field for any of the 53 references. Do not infer THR, SMT, wave or manual-process suitability from a photo, pitch, mounting direction or similar external product.
Can I reuse a reflow temperature from a similar terminal block?
No. Material system, exact suffix, packaging, moisture classification, permitted cycles and the applicable process document can differ. Request the exact-model evidence and validate it on the intended line.
What should I send for a PCB terminal block solder-process review?
Send the exact model or application, pitch and positions, PCB/land pattern, planned THT/wave/THR/SMT route, board and line constraints, packaging, cleaning, quantity, target market and required process documents.
TURN THE LINE REQUIREMENT INTO AN RFQ
Send the board, process, packaging and evidence requirement together.
Keep every unknown field open. YIHENTRA should confirm the exact model-level documents and sample action before any process capability is assumed.